As AI infrastructure and high-performance computing systems drive increasing power densities, thermal validation is becoming increasingly critical in the design, planning, design verification, and development of the chip-wafer layout cooling system. KLC’s TTV solutions provide controllable heat sources to simulate heat loads in high-power electronic devices and advanced semiconductor architectures, helping engineers perform early-phase chip and wafer layout and architecture design verification while accurately evaluating cooling performance in cold plates and liquid cooling systems.
These solutions support thermal validation for applications involving AI servers, GPU platforms, advanced packaging, and semiconductor wafer devices, helping engineering teams evaluate cooling designs and thermal performance during wafer design and product development processes.
In the automotive sector, KLC supplies high-voltage coolant heaters for battery preheating and cabin heating. Depending on the series, its solutions offer voltage ratings from 12 to 400 VDC and output powers of up to 12,000 W, meeting the diverse thermal management requirements of electric vehicles.
“From chip and wafer layout design planning and AI/HPC cooling validation to EV heating, thermal management is critical to next-generation automotive and semiconductor systems,” said Joanna Wu, CEO of KLC Corporation. “KLC combines thermal testing capabilities and heating technologies to support its customers in the development of increasingly demanding applications.”
KLC serves customers in the automotive, industrial, and semiconductor industries, including engineering teams working on chip layout design verification on wafers, power electronics, and thermal management systems.
